Thermal management materials for 3D-stacked integrated circuits
Wei‐Yen Woon, А. В. Касперович, Je-Ruei Wen, K. K. Hu, Mohamadali Malakoutian, Jin-Hao Jhang, Sam Vaziri, I. Datye, C. C. Shih, James T. Hsu, Xinyu Bao, Yunhui Wu, Masahiro Nomura, Srabanti Chowdhury, Samuel M. Liao
Topics & Concepts
Thermal management of electronic devices and systemsThree-dimensional integrated circuitIntegrated circuitMaterials scienceElectronic circuitThermalComputer scienceOptoelectronicsEngineeringElectrical engineeringMechanical engineeringPhysicsMeteorologyThermal properties of materialsHeat Transfer and OptimizationSemiconductor materials and devices