Investigation on the material removal mechanism of sapphire wafer by novel green slurry in semi-fixed abrasive polishing
Guangen Zhao, Jianxiong Chen, Yongchao Xu, Cheng Peng, Qianting Wang
Topics & Concepts
AbrasiveMaterials sciencePolishingSlurryWaferMetallurgySapphireChemical-mechanical planarizationMechanism (biology)Composite materialNanotechnologyOpticsLaserEpistemologyPhilosophyPhysicsAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvanced Machining and Optimization Techniques