Design and evaluation of in-plane silicon microneedles fabricated with post-CMOS compatible processes
Abdulla Al Mamun, Brandon Sueoka, Noah Allison, Yue Huang, Feng Zhao
Topics & Concepts
Materials scienceBucklingComposite materialBendingFinite element methodWaferStress (linguistics)Structural engineeringOptoelectronicsEngineeringPhilosophyLinguisticsAdvancements in Transdermal Drug DeliveryNeuroscience and Neural EngineeringAdvanced Fluorescence Microscopy Techniques