Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures
Wangyun Li, Chuantong Chen, Minoru Ueshima, Takaya Kobatake, Katsuaki Suganuma
Topics & Concepts
SinteringMaterials scienceMicrostructureInterconnectionShear strength (soil)Joint (building)Composite materialShear (geology)MetallurgyDuctility (Earth science)Substrate (aquarium)CreepStructural engineeringGeologySoil scienceComputer scienceSoil waterEnvironmental scienceOceanographyComputer networkEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis