Litcius/Paper detail

Grain size and grain boundary characteristics on the out-plane thermal conductivity of <111>-oriented CVD 3C–SiC

Wei Ding, Pengjian Lu, Qingfang Xu, Chitengfei Zhang, Rong Tu, Song Zhang

2024Ceramics International13 citationsDOI

Topics & Concepts

Materials scienceGrain boundaryThermal conductivityGrain sizePlane (geometry)ConductivityThermalCondensed matter physicsComposite materialThermodynamicsGeometryMicrostructurePhysicsMathematicsQuantum mechanicsSilicon Carbide Semiconductor TechnologiesAdvanced ceramic materials synthesisAluminum Alloys Composites Properties