Investigation of Z-type manifold microchannel cooling for ultra-high heat flux dissipation in power electronic devices
Shudong Yang, Junye Li, Biqi Cao, Zan Wu, Kuang Sheng
Topics & Concepts
Materials scienceMicrochannelHeat fluxThermal resistancePressure dropHeat transferHeat transfer coefficientCoolantHeat sinkComputer coolingMechanicsThermal conductionThermodynamicsComposite materialMechanical engineeringThermal management of electronic devices and systemsNanotechnologyPhysicsEngineeringHeat Transfer and OptimizationHeat Transfer MechanismsHeat Transfer and Boiling Studies