Brief overview of the impact of thermal stress on the reliability of through silicon via: Analysis, characterization, and enhancement
Shuiquan Tang, Jieshi Chen, Yi Hu, Yu Gun Chun, Lu Hao, Shuye Zhang, Kai Xiong
Topics & Concepts
Materials scienceCharacterization (materials science)Reliability (semiconductor)SiliconStress (linguistics)Engineering physicsReliability engineeringNanotechnologyOptoelectronicsEngineeringThermodynamicsPhysicsLinguisticsPhilosophyPower (physics)3D IC and TSV technologiesIntegrated Circuits and Semiconductor Failure AnalysisSemiconductor materials and devices