Thermal management of 3D chip with non-uniform hotspots by integrated gradient distribution annular-cavity micro-pin fins
Shuai Feng, Yunfei Yan, Haojie Li, Li Zhang, Shilin Yang
Topics & Concepts
Materials scienceHeat transferHeat fluxHotspot (geology)Temperature gradientMechanicsFinHeat sinkThermal resistanceHeat spreaderCoolantThermalEnhanced heat transferHeat transfer enhancementChipComposite materialHeat transfer coefficientThermodynamicsPhysicsEngineeringElectrical engineeringMeteorologyGeophysicsHeat Transfer and Optimization3D IC and TSV technologiesHeat Transfer and Boiling Studies