Simulation of crack propagation in solder layer of IGBT device under temperature shock by viscoplastic phase field method
Kai Yang, Longzao Zhou, Fengshun Wu, Guang Yang, Liguo Ding, Kewei Li, Xuemin Li
Topics & Concepts
Materials scienceViscoplasticitySolderingThermal shockInsulated-gate bipolar transistorFracture mechanicsComposite materialShock (circulatory)Layer (electronics)Phase (matter)Structural engineeringFinite element methodElectrical engineeringConstitutive equationEngineeringVoltageOrganic chemistryChemistryMedicineInternal medicineNumerical methods in engineeringMetal Forming Simulation TechniquesMetallurgy and Material Forming