Robust, high-temperature and solvent tolerant, yet detachable polyimide adhesives enabled by dynamic boroxines
Xiaochan Chen, Song Chen, Xinyu Chen, Haixun Zheng, Yubing Fu, Fang Liu, Qiang Liu, Guoping Zhang, Lan Liu, Guoping Zhang, Lan Liu
Topics & Concepts
Materials sciencePolyimideAdhesiveUltimate tensile strengthSolventBond strengthComposite materialCovalent bondAdhesionPolymer chemistryChemical engineeringOrganic chemistryChemistryEngineeringLayer (electronics)Synthesis and properties of polymersEpoxy Resin Curing Processes