Epoxy composite films of superior dielectric properties promoted by active ester hardeners for applications in electronic packaging
Feng Zhang, Peng Li, Lin Wang, Shuhui Yu, Rong Sun, Keyu Zheng, Suibin Luo, Keyu Zheng, Suibin Luo
Topics & Concepts
EpoxyMaterials scienceDielectricThermal stabilityComposite materialComposite numberCuring (chemistry)Dielectric lossChemical engineeringOptoelectronicsEngineeringSynthesis and properties of polymersEpoxy Resin Curing ProcessesSilicone and Siloxane Chemistry