Effect of thermal stress on anisotropic grain growth in nano-twinned and un-twinned copper films
I-Hsin Tseng, Yun-Ting Hsu, Jihperng Leu, K. N. Tu, Chih Chen
Topics & Concepts
Materials scienceCopperComposite materialMicrostructureGrain growthWaferElectroplatingStress (linguistics)AnisotropyGrain sizeSubstrate (aquarium)Thin filmMetallurgyNanotechnologyOpticsLayer (electronics)OceanographyPhilosophyGeologyPhysicsLinguisticsCopper Interconnects and ReliabilityMetal and Thin Film MechanicsMicrostructure and mechanical properties