Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test
Chuantong Chen, Zheng Zhang, Dongjin Kim, Tetsuya Sasamura, Yukinori Oda, Ming-Chun Hsieh, Aya Iwaki, Aiji Suetake, Katsuaki Suganuma
Topics & Concepts
Materials scienceThermal shockComposite materialMicrostructureSinteringdBcMetallurgyShear strength (soil)Layer (electronics)Joint (building)CopperCMOSSoil scienceEngineeringOptoelectronicsEnvironmental scienceSoil waterArchitectural engineeringElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties