High performance epoxy resin with efficient electromagnetic wave absorption and heat dissipation properties for electron packaging by modification of 3D MDCF@hBN
Yongxin Qian, Tao Yang, You Li, Jinian Hao, Chaochao Xu, Wei Yan, Qinghui Jiang, Yubo Luo, Junyou Yang
Topics & Concepts
EpoxyDissipationAbsorption (acoustics)Materials scienceThermal management of electronic devices and systemsElectronComposite materialHigh heatMechanical engineeringPhysicsThermodynamicsEngineeringQuantum mechanicsElectromagnetic wave absorption materialsMechanical Behavior of CompositesThermal properties of materials