Performance and reliability of nanoparticle-reinforced lead-free solder composite joints
Kaiming Liang, Wenqiang Wan, Xiangdong Ding, Peng He, Shuye Zhang
Topics & Concepts
Materials scienceComposite numberSolid mechanicsSolderingComposite materialReliability (semiconductor)NanoparticleLead (geology)NanotechnologyQuantum mechanicsPhysicsPower (physics)GeologyGeomorphologyElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesMaterial Properties and Applications