Simulation and verification of thermal conductivity of CuCr30 contact material based on morphological changes of Cr particles
Xiangfeng Zhang, Xiuhua Guo, Kexing Song, Xu Wang, Jiang Feng, Shaolin Li, Huanran Lin
Topics & Concepts
Materials scienceThermal conductivityThermal contact conductanceThermal conductionComposite materialDeformation (meteorology)Thermal contactAnisotropyParticle (ecology)Heat transferExtrusionContact areaThermalThermal resistanceMechanicsThermodynamicsOceanographyGeologyQuantum mechanicsPhysicsVacuum and Plasma ArcsThermal properties of materialsAdvanced ceramic materials synthesis