Diffusion anisotropy induced uneven regional growth of Cu6Sn5 IMC in Cu/SAC305/Cu micro solder joints under temperature gradient
Yuanyuan Qiao, Haitao Ma, Ning Zhao
Topics & Concepts
IntermetallicSolderingMaterials scienceDiffusionAnisotropyComposite materialMetallurgyAlloyThermodynamicsOpticsPhysicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis