Litcius/Paper detail

High strength and high electrical conductivity C70250 copper alloy with fibrous structure reinforced by high density, multi-scale nano-precipitates and dislocation

Wanneng Liao, Yangyang Hu, Qinjiang Liu

2022Materials Science and Engineering A32 citationsDOI

Topics & Concepts

Materials scienceAlloyElectrical resistivity and conductivityMicrostructureUltimate tensile strengthPrecipitation hardeningPrecipitationComposite materialMetallurgyDeformation (meteorology)DislocationWork hardeningCopperConductivityEngineeringPhysicsChemistryPhysical chemistryMeteorologyElectrical engineeringMicrostructure and mechanical propertiesAluminum Alloys Composites PropertiesAluminum Alloy Microstructure Properties