Improvements in the properties of low-Ag SAC105 solder alloys with the addition of tellurium

Panisara Sukhontapatipak, Phairote Sungkhaphaitoon

2023Journal of Materials Science Materials in Electronics14 citationsDOI

Topics & Concepts

Materials scienceSolderingMicrostructureSupercoolingUltimate tensile strengthMetallurgyAlloyWettingPhase (matter)TelluriumBrittlenessComposite materialOrganic chemistryPhysicsThermodynamicsChemistryElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesMetallurgical and Alloy Processes