Litcius/Paper detail

Thermal and stress impacts on vacancy diffusion through atomistic simulations

Bin Dong, Yi Fu, Haifei Zhan, Chaofeng Lü

2022International Journal of Mechanical Sciences20 citationsDOI

Topics & Concepts

Vacancy defectMaterials scienceDiffusionStress (linguistics)ThermalForensic engineeringCrystallographyThermodynamicsEngineeringPhysicsChemistryLinguisticsPhilosophyMicrostructure and mechanical propertiesHigh Temperature Alloys and CreepNuclear Materials and Properties
Thermal and stress impacts on vacancy diffusion through atomistic simulations | Litcius