Effect of h-BN and Nano-SiO2 Fillers on the High-Temperature Tribological Properties of PEEK/PI-Based Composites
Mengjiao Li, Jingjing Yang, Shengqi Ma, Gang Liu, Hongru Yang, Jianan Yao
Abstract
PEEK is being used increasingly often in seals, bushings, bearings, and other moving parts due to its excellent mechanical and tribological properties. Herein, PEEK-based composites were prepared using PI as the organic filler and h-BN and nano-SiO2 particles as the inorganic fillers. There was significant improvement in the tribological properties of PEEK at conditions above the glass transition temperature; the coefficient of friction of +20P/4B/4Si was stabilized at 0.06 at 200 °C and the wear rate was reduced by 60% compared to PEEK. The role played by the thermal conductivity of h-BN and the promotion of friction transfer film by nano-SiO2 in improving the tribological properties of PEEK is illustrated. The modified composites exhibited stable mechanical and tribological properties over a wide temperature range, which is instructive for instrumentation and testing applications in harsh environments.