Improving mechanical stability of Al/Cu ultrasonic bonded joint for battery tab by adopting electroplated Ni interlayer
Jong‐Min Jeong, Dongjin Kim, Jung Soo Kim, Junghwan Bang, Seung‐Boo Jung, Min‐Su Kim
Topics & Concepts
ElectroplatingBattery (electricity)Ultrasonic sensorMaterials scienceJoint (building)MetallurgyComposite materialStructural engineeringEngineeringAcousticsPhysicsThermodynamicsLayer (electronics)Power (physics)Advanced Welding Techniques AnalysisAluminum Alloys Composites PropertiesElectronic Packaging and Soldering Technologies