Formation of high aspect ratio through-glass vias by the combination of Ultrasonic micromachining and copper electroplating
Harsh Pandey, Tarlochan Singh, Pradeep Dixit
Topics & Concepts
Materials scienceUltrasonic sensorSurface micromachiningElectroplatingAbrasiveUltrasonic machiningSiliconFabricationLIGABulk micromachiningComposite materialCopperFrench hornMachiningOptoelectronicsMetallurgyAcousticsLayer (electronics)PathologyMedicinePhysicsAlternative medicineAdvanced Machining and Optimization Techniques3D IC and TSV technologiesAdvanced Surface Polishing Techniques