Exploring the underlying causes of optimizing thermal conductivity of copper/diamond composites by interface thickness
Jianquan Sang, Ye Yuan, Wulin Yang, Jiajun Zhu, Licai Fu, Deyi Li, Lingping Zhou
Topics & Concepts
Materials scienceThermal conductivityComposite materialDiamondInterfacial thermal resistanceNanoindentationPhonon scatteringComposite numberCopperAnnealing (glass)Thermal resistanceThermalMetallurgyMeteorologyPhysicsThermal properties of materialsAdvanced ceramic materials synthesisAluminum Alloys Composites Properties