Achieving excellent thermal transport in diamond/Cu composites by breaking bonding strength-heat transfer trade-off dilemma at the interface
Guo Chang, Shuang Zhang, Kaiyun Chen, Wei Zhang, Liang Li, Yongjian Zhang, Haoran Peng, Dongxiao Kan, Lühua Wang, Hailong Zhang, Wangtu Huo, Lühua Wang, Hailong Zhang, Wangtu Huo
Topics & Concepts
Materials scienceComposite materialDiamondThermalInterface (matter)Heat transferThermal transferBonding strengthLayer (electronics)MeteorologyCapillary numberThermodynamicsCapillary actionPhysicsAdvanced ceramic materials synthesisThermal properties of materialsAdvanced materials and composites