Litcius/Paper detail

Pumping and shrinking deformation of TSV-Cu under thermal cycling loads: A cross-scale analysis approach

Zhengwei Fan, Kaihong Hou, Yonggui Chen, Shufeng Zhang, Yashun Wang, Xun Chen

2025Materials Science in Semiconductor Processing15 citationsDOI

Topics & Concepts

Materials scienceTemperature cyclingCyclingComposite materialDeformation (meteorology)Scale (ratio)ThermalStructural engineeringThermodynamicsEngineeringQuantum mechanicsPhysicsArchaeologyHistory3D IC and TSV technologiesAluminum Alloys Composites PropertiesAdvanced ceramic materials synthesis
Pumping and shrinking deformation of TSV-Cu under thermal cycling loads: A cross-scale analysis approach | Litcius