Rapid and low temperature sintering bonding using Cu nanoparticle film for power electronic packaging
Yongchao Wu, Guisheng Zou, Shuaiqi Wang, Wei Guo, Hongqiang Zhang, Peng Peng, Bin Feng, Lei Liu
Topics & Concepts
SinteringMaterials sciencedBcNanoparticleInert gasEthylene glycolInertMicrostructurePorosityShear strength (soil)Composite materialCopperMetallurgyChemical engineeringNanotechnologyOptoelectronicsCMOSPhysicsSoil waterSoil scienceEngineeringQuantum mechanicsEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability