Power cycling failure analysis of double side cooled IGBT modules for automotive applications
Yaqing Ma, Jianfeng Li, Fangfang Dong, Jun Yu
Topics & Concepts
Insulated-gate bipolar transistorPower cyclingHeat sinkPower moduleTemperature cyclingJunction temperatureReliability (semiconductor)ChipPower densityPower semiconductor deviceBipolar junction transistorMaterials sciencePower (physics)Automotive engineeringElectronic engineeringElectrical engineeringTransistorThermalEngineeringVoltageMeteorologyPhysicsQuantum mechanicsSilicon Carbide Semiconductor TechnologiesElectrostatic Discharge in ElectronicsSemiconductor materials and devices