Dynamic growth mechanism of tin whisker driven by compressive stress under thermal-mechanic-electric-diffusion coupling
Long Zhang, Junfeng Li, Dengjie Xiong, Manru Xu, Limeng Yin, Hehe Zhang, Zhongxiang Yao
Topics & Concepts
WhiskerTinMaterials scienceWhiskersStress (linguistics)ElectromigrationStress relaxationComposite materialTemperature gradientMetallurgyLinguisticsPhysicsPhilosophyQuantum mechanicsCreepElectronic Packaging and Soldering Technologiesnanoparticles nucleation surface interactionsIntermetallics and Advanced Alloy Properties