Process dependence and nucleus models of β-Sn grains in SAC305 freestanding solder balls and BGA solder joints
Xiaolei Ren, Y.P. Wang, X.Y. Liu, Longjiang Zou, Ning Zhao
Topics & Concepts
Ball grid arraySolderingMaterials scienceMicrostructureGrain sizeBall (mathematics)Composite materialAnisotropyMetallurgyGeometryPhysicsQuantum mechanicsMathematicsElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure Properties3D IC and TSV technologies