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Microchannel heat sinks with nanofluids for cooling electronic components: Performance enhancement, challenges, and limitations

Hussein M. Maghrabie, A.G. Olabi, Enas Taha Sayed, Tabbi Wilberforce, Khaled Elsaid, Mohammad Hossein Doranehgard, Mohammad Ali Abdelkareem

2022Thermal Science and Engineering Progress103 citationsDOI

Topics & Concepts

NanofluidElectronicsHeat sinkMicrochannelElectronics coolingMaterials scienceHeat transferElectronic componentHeat fluxHeat transfer enhancementThermalWork (physics)Mechanical engineeringComputer coolingCurrent (fluid)Thermal management of electronic devices and systemsNanotechnologyNanoparticleMechanicsHeat transfer coefficientThermodynamicsElectrical engineeringEngineeringPhysicsNanofluid Flow and Heat TransferHeat Transfer and OptimizationHeat Transfer Mechanisms
Microchannel heat sinks with nanofluids for cooling electronic components: Performance enhancement, challenges, and limitations | Litcius