The optimization of copper electroplating aiming at uniformity enhancement with the numerical model and response surface method
Chih-Chun Su, Chuan-Ping Kao, Ping‐Feng Yang, Jen-Kuang Fang, Hou-Chien Chang
Topics & Concepts
ElectroplatingCopperResponse surface methodologyMaterials scienceBiological systemMetallurgyChemistryComposite materialChromatographyBiologyLayer (electronics)Electrodeposition and Electroless CoatingsCorrosion Behavior and InhibitionElectronic Packaging and Soldering Technologies