Optimizing the heat source layout of chips using bionic method: Reduction of junction temperature
Hao Dang, Qian Zhang, Yang Lu, Xiu Zhang, Weigang Ma, Xing Zhang
Topics & Concepts
Ball grid arrayMaterials scienceThermal resistanceComputer scienceThermal management of electronic devices and systemsJunction temperatureThermalChipEnhanced Data Rates for GSM EvolutionMechanical engineeringComposite materialThermodynamicsEngineeringSolderingTelecommunicationsPhysicsHeat Transfer and OptimizationThermal properties of materialsAdvanced Multi-Objective Optimization Algorithms