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Optimizing the heat source layout of chips using bionic method: Reduction of junction temperature

Hao Dang, Qian Zhang, Yang Lu, Xiu Zhang, Weigang Ma, Xing Zhang

2022International Journal of Heat and Mass Transfer22 citationsDOI

Topics & Concepts

Ball grid arrayMaterials scienceThermal resistanceComputer scienceThermal management of electronic devices and systemsJunction temperatureThermalChipEnhanced Data Rates for GSM EvolutionMechanical engineeringComposite materialThermodynamicsEngineeringSolderingTelecommunicationsPhysicsHeat Transfer and OptimizationThermal properties of materialsAdvanced Multi-Objective Optimization Algorithms
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