Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging
Huan Hu, Qiang Jia, Yishu Wang, Bolong Zhou, Hongqiang Zhang, Mingan Zhang, Limin Ma, Guisheng Zou, Fu Guo
Topics & Concepts
Materials scienceNanoparticleMechanism (biology)Electronic packagingNanotechnologyChemical engineeringComposite materialEngineeringEpistemologyPhilosophyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanomaterials and Printing Technologies