An electromigration study of novel 3D Cu stack-via interconnects for advanced high-density fan-out packaging
Kuan-Ju Shao, Meng-Chun Chiu, Chien-Lung Liang, Min‐Yan Tsai, Yung‐Sheng Lin, Chen-Chao Wang, Chih-Pin Hung, Kwang‐Lung Lin, Kwang‐Lung Lin
Topics & Concepts
ElectromigrationMaterials scienceStack (abstract data type)Copper interconnectInterconnectionCurrent densityEngineering physicsOptoelectronicsComposite materialLayer (electronics)Computer scienceEngineeringTelecommunicationsPhysicsQuantum mechanicsProgramming languageElectronic Packaging and Soldering Technologies3D IC and TSV technologiesCopper Interconnects and Reliability