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Undeformed chip thickness modeling in EUVAG considering wheel topography evolution

Kun Zhang, Zhen Yin, Yanjun Lu, Chenwei Dai, Qinglong An, Zhiqiang Liang, Qing Miao, Ming Zhang, Ziyang Cao, Hua Li

2025International Journal of Mechanical Sciences5 citationsDOI

Topics & Concepts

ChipMaterials scienceMechanical engineeringGeometryEngineeringMathematicsElectrical engineeringAdvanced Surface Polishing TechniquesAdvanced machining processes and optimizationAdvancements in Photolithography Techniques
Undeformed chip thickness modeling in EUVAG considering wheel topography evolution | Litcius