Microstructure transformation and mechanical properties of Al alloy joints soldered with Ni-Cu foam/Sn-3.0Ag-0.5Cu (SAC305) composite solder
Cong Xiong, Yong Xiao, Jian Zhang, Dan Luo, Russell Goodall
Topics & Concepts
SolderingMaterials scienceMicrostructureComposite numberComposite materialAlloyShear strength (soil)Phase (matter)IntermetallicShearing (physics)MetallurgyChemistryEnvironmental scienceSoil waterSoil scienceOrganic chemistryElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesAdvanced Welding Techniques Analysis