Strong and efficient bismuth telluride-based thermoelectrics for Peltier microcoolers
Hua‐Lu Zhuang, Bowen Cai, Yu Pan, Bin Su, Yilin Jiang, Jun Pei, Fengming Liu, Haihua Hu, Jincheng Yu, Jingwei Li, Zhengqin Wang, Zhanran Han, Hezhang Li, Chao Wang, Jing‐Feng Li
Abstract
ABSTRACT Thermoelectric Peltier coolers (PCs) are being increasingly used as temperature stabilizers for optoelectronic devices. Increasing integration drives PC miniaturization, requiring thermoelectric materials with good strength. We demonstrate a simultaneous gain of thermoelectric and mechanical performance in (Bi, Sb)2Te3, and successfully fabricate micro PCs (2 × 2 mm2 cross-section) that show excellent maximum cooling temperature difference of 89.3 K with a hot-side temperature of 348 K. A multi-step process involving annealing, hot-forging and composition design, is developed to modify the atomic defects and nano- and microstructures. The peak ZT is improved to ∼1.50 at 348 K, and the flexural and compressive strengths are significantly enhanced to ∼140 MPa and ∼224 MPa, respectively. These achievements hold great potential for advancing solid-state refrigeration technology in small spaces.