Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments
Nick Ross, Muthappan Asokan, Goutham Issac Ashok Kumar, Joshua Caperton, John Alptekin, Ashish Shivaji Salunke, Oliver Chyan
Topics & Concepts
CorrosionBimetallic stripWire bondingMaterials scienceCopperChlorideCathodic protectionMicroelectronicsMetallurgyAluminiumCopper wireComposite materialMetalElectrochemistryElectrodeChemistryNanotechnologyElectrical engineeringChipEngineeringPhysical chemistryCorrosion Behavior and InhibitionConcrete Corrosion and DurabilityHydrogen embrittlement and corrosion behaviors in metals