Heat-assisted pulsed laser processing induced nano-cracks for low kerf-loss and high-surface quality SiC wafer slicing
Xiangfu Liu, Hong Minghui
Topics & Concepts
SlicingMaterials scienceWaferNano-LaserQuality (philosophy)MetallurgyComposite materialOptoelectronicsOpticsMechanical engineeringEngineeringEpistemologyPhilosophyPhysicsAdvanced Surface Polishing TechniquesLaser Material Processing TechniquesIntegrated Circuits and Semiconductor Failure Analysis