A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication
Anastasiia Kruv, Mireia Bargalló González, Oguzhan Orkut Okudur, Valentina Spampinato, Alexis Franquet, Senthil Vadakupudhu Palayam, A. Arreghini, G. Van den bosch, M. Rosmeulen, Ingrid De Wolf
Topics & Concepts
FabricationResidual stressWaferNAND gateMaterials scienceAnnealing (glass)LithographyStress (linguistics)Semiconductor device fabricationOptoelectronicsElectronic engineeringComposite materialLogic gateEngineeringAlternative medicineLinguisticsPathologyPhilosophyMedicineMetal and Thin Film MechanicsSemiconductor materials and devicesAdvanced Surface Polishing Techniques