Stress analysis and thermal performance of ultra-thin heat pipes for compact electronics
Heng Tang, Yansong Xie, Yong Tang, Xiaoyu Wu, Chunxia Wu, Yalong Sun
Topics & Concepts
Materials scienceFlatteningHeat transferThermal resistanceHeat pipeComposite materialElectronics coolingStress (linguistics)Intensity (physics)ThermalMechanicsThermodynamicsOpticsLinguisticsPhilosophyPhysicsHeat Transfer and Boiling StudiesHeat Transfer and OptimizationHeat Transfer Mechanisms