High power density thermal management of discrete semiconductor packages enabled by additively manufactured hybrid polymer-metal coolers
Aniket Ajay Lad, Muhammad Jahidul Hoque, Shamar Christian, Yue Zhao, Juan Carlos Balda, William P. King, Nenad Miljkovic
Topics & Concepts
Heat sinkMaterials scienceCoolantMetal foamThermal resistancePressure dropFinComputer coolingComposite materialHeat transferMechanical engineeringSilicon carbideAluminiumMechanicsThermal management of electronic devices and systemsEngineeringPhysicsHeat Transfer and OptimizationSilicon Carbide Semiconductor TechnologiesThermal properties of materials