A full-field warpage characterization measurement method coupled with infrared information
Baoshan Zeng, Yuhan Gao, Chuanguo Xiong, Xin Lei, Weishan Lv, Fulong Zhu
Topics & Concepts
MicroelectronicsCalibrationInfraredReliability (semiconductor)Field (mathematics)Characterization (materials science)Materials scienceTemperature measurementDeformation (meteorology)Computer scienceOpticsElectronic engineeringOptoelectronicsEngineeringComposite materialMathematicsPhysicsNanotechnologyPower (physics)StatisticsPure mathematicsQuantum mechanicsElectronic Packaging and Soldering TechnologiesOptical measurement and interference techniquesAdvanced Sensor Technologies Research