Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging
Xi Huang, Liang Zhang, Jiamin Zhang, Chen Chen, Xiao Lu, Lei Sun
Topics & Concepts
IntermetallicSolderingMaterials scienceMicrostructureJoint (building)BrittlenessLayer (electronics)MetallurgyShear (geology)Shear strength (soil)Composite materialStructural engineeringEnvironmental scienceAlloySoil waterEngineeringSoil scienceElectronic Packaging and Soldering TechnologiesAluminum Alloys Composites PropertiesIntermetallics and Advanced Alloy Properties