RETRACTED ARTICLE: Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach
Tzu-Chia Chen, Maria Jade Catalan Opulencia, Hasan Sh. Majdi, Ali Thaeer Hammid, Himanshu Sharma, Sami Sajjadifar, A. Surendar
Topics & Concepts
Ball grid arraySolderingInterconnectionCreepMaterials scienceTemperature cyclingReliability (semiconductor)Finite element methodBall (mathematics)Computer scienceMechanical engineeringThermalStructural engineeringComposite materialEngineeringPower (physics)Quantum mechanicsMathematicsPhysicsComputer networkMeteorologyMathematical analysisElectronic Packaging and Soldering TechnologiesHigh Temperature Alloys and CreepAluminum Alloy Microstructure Properties