Structural, electrical, and thermal features of polyimide composites filled with semiconductive MXene sheets
Qi‐Kun Feng, Jia‐Yao Pei, Qi Dong, Shao‐Long Zhong, Weiwei Lu, Dongli Zhang, Chang Liu, Zhi‐Min Dang
Abstract
Polymer-based dielectrics are widely applied in the fields of electronics and electrical power systems due to the high breakdown strength, excellent flexibility, and unique self-healing capability. However, the low stored energy density and unsatisfactory heat management of polymer dielectrics hinder the development of polymer-based film capacitors. In this research, artificial composites with improved capacitive energy storage and thermal conductivity are fabricated by blending the two-dimensional semiconductive MXene sheets with a polyimide (PI) matrix. Remarkably, a PI based composite with 1 wt. % MXene sheets increases its dielectric permittivity from ≈3.27 to ≈3.53 and enhances its discharged energy density from ≈1.93 to ≈2.38 J/cm3 while maintaining its low dielectric loss of <0.02 and relatively high charge–discharge efficiency of >80%. Meanwhile, a high in-plane thermal conductivity of 0.418 W m−1 K−1 is achieved for PI/MXene composites with 5 wt. % MXene. In addition, the distribution of temperature field inside the composites has been investigated by a finite element method. These results represent a strategy in polymer dielectrics to achieve simultaneous high energy density and thermal conductivity, which may also have potential for applications in high temperature environments.