Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing
Shuai Zhang, Hongyun Zhao, Hongbo Xü, Xing Fu
Topics & Concepts
SolderingTemperature cyclingReliability (semiconductor)Materials scienceFailure mode and effects analysisTECWeibull distributionTest methodThermalFailure mechanismIntermetallicReliability engineeringStructural engineeringComposite materialEngineeringPower (physics)MeteorologyAstronomyPaleontologyBiologyAlloyMathematicsStatisticsPhysicsQuantum mechanicsIonosphereElectronic Packaging and Soldering TechnologiesIntegrated Circuits and Semiconductor Failure AnalysisAluminum Alloy Microstructure Properties