Ultrafast pulsed laser stealth dicing of 4H-SiC wafer: Structure evolution and defect generation
Lingfeng Wang, Chen Zhang, Feng Liu, Huai Zheng, Gary J. Cheng
Topics & Concepts
Wafer dicingMaterials scienceLaserFemtosecondWaferUltrashort pulseOpticsOptoelectronicsPicosecondUltrafast laser spectroscopyFluencePhysicsLaser Material Processing TechniquesAdvanced Surface Polishing TechniquesCultural Heritage Materials Analysis