Microstructural evolution and degradation mechanism of SiC–Cu chip attachment using sintered nano-Ag paste during high-temperature ageing
Fan Yang, Wenbo Zhu, Weizhen Wu, Hongjun Ji, Chunjin Hang, Mingyu Li
Topics & Concepts
Materials scienceSinteringMicrostructurePorosityComposite materialOxideDegradation (telecommunications)Service lifeMetallurgyElectronic engineeringEngineeringAluminum Alloys Composites PropertiesElectronic Packaging and Soldering TechnologiesAdvanced ceramic materials synthesis